Intel’s next-gen Arrow Lake may introduce some major changes to desktop chips

Intel had a busy Computex, with one of their most exciting announcements slipping under the radar. They will soon be expanding their range of desktop processors with the next-gen Arrow Lake. We now have an idea of when these CPUs will hit the market and the improvements we can expect. It’s worth noting that some of the new Z890 motherboards will also support CAMM2 memory.

According to Wccftech, Intel plans to officially unveil Arrow Lake in September during the Intel Innovation event. The processors will then be launched sometime in October of this year. Desktop users will be the first to have access to Arrow Lake, while laptop chips will be available at a later date. In the meantime, laptop users have the Lunar Lake to look forward to this year.
The exact details of the initial lineup are uncertain, but it is confirmed that Intel is introducing a new naming scheme for desktop processors. It is inevitable to familiarize ourselves with this new branding. As a result, the Arrow Lake CPUs will now be known as the Intel Core Ultra 200 series. Some of the expected chips in this series include the Core Ultra 9 285K, Core Ultra 7 265K, and Core Ultra 5 245K. Non-overclockable versions will be released at a later date.
The upcoming Core Ultra 200 series will retain a combination of efficient and high-performance cores, namely Lion Cove P-cores and Skymont E-cores. According to Wccftech, the new P-cores are expected to offer a 14% increase in instructions per cycle (IPC) compared to the previous generation, while the E-cores could potentially deliver an even more impressive upgrade of up to 38% in IPC. Although the exact clock speeds remain unknown, it is likely that they will exceed 5.5GHz. Additionally, there are indications of a lower thermal design power (TDP) compared to Raptor Lake chips, potentially reducing the maximum clock speed or overclocking capabilities.

Unfortunately, if you currently have an Intel processor and are looking to upgrade, there is some bad news. The upcoming Arrow Lake processors will require a new socket, the LGA1851, which means that current LGA 1700 motherboards will not be compatible. However, Intel’s partners have already begun showcasing the new Z890 motherboards at the Computex show. One interesting feature of these boards is that some of them support the new CAMM2 memory standard, which is a significant departure from the familiar SO-DIMM interface we are accustomed to using.

CAMM2 is being touted by many manufacturers as a potential replacement for SO-DIMM. It is thinner, can activate dual-channel memory with just one module, and has the capability to achieve higher speeds and tighter timings. Additionally, it could serve as a viable alternative to soldered memory in laptops.
Intel’s next-generation CPUs, known as Zen 5 processors, are scheduled to be released in July. Despite this delayed launch compared to its competitors, Intel’s introduction of a new socket and support for CAMM2 memory modules may make it an appealing option for individuals looking to construct a new PC.